Dear Robert:
I read with much interest the sample materials which you forwarded
from Technical Insights. I would personally enjoy reading this
publication every week. I wonder if other members of our group
would also like to receive it on a regular basis. I also wonder if
it would contribute anything to our work.
In view of the fact that this is "sample" material, I am sure that
the publisher will not object to sharing it with the group to see
what their reaction is. Accordingly, I am posting it immediately
and ask each member of the group to let me know if we should
consider subscribing for future issues. I also want to know how
much should we be willing to pay for the subscription.
Thanks for keeping me informed.
Tim Cranmer
Begin Technical Insights
ADVANCES IN ELECTRONICS TECHNOLOGY
TECHNICAL INSIGHTS ALERT
A Service from Technical Insights, Inc.
August 13, 1993
Copyright 1993, Technical Insights, Inc., Englewood, NJ USA
Phone: 201-568-4744
LICENSED FOR INTERNAL COMPANY USE ONLY
DISSEMINATION OUTSIDE OF THE COMPANY IS PROHIBITED
ER930606 SILICON QUANTUM WELL
ER930608 FASTEST TELECOM LASERS
ER930613 COMPACT LASER TUNABLE OVER VISIBLE SPECTRUM
ER930615 SOL-GEL FRESNEL LENS KEY TO LASER COMMUNICATIONS
ER930617 MOVING IMAGE TRACKING SYSTEMS
EM930617 MONITOR EPITAXIAL FILM GROWTH
EM930618 CHEAP THICK-FILM SUPERCONDUCTORS
EA930596 SINGLE-MASK PROCESS BUILDS MICRORESONATOR
EA930599 DESIGN LOW-NOISE, LOW-DRIFT ELECTRONICS
EA930602 MOTION ANALYZER RECORDS BRIEF, HIGH-SPEED EVENTS
***************************************************
To get further details on the advances noted below,
just call/write/fax the contact named
at the end of the briefing.
***************************************************
ER930606
2081893
SILICON QUANTUM WELL
Physicists were at first skeptical of patented (US Patent
5,216,262) but unproven technique with "why-didn't-I-think-of-
that" quality -- silicon-based quantum wells. University of North
Carolina physicist Raphael Tsu co-inventor (with Nobelist L.
Esaki) of the resonant tunneling transistor which is the basis of
restricted-dimension electronics, now envisions superlattice
strain-layers as barriers for functional transistors. Compared
with conventional transistors, which respond to just two voltages
to produce characteristic On/Off states, functional transistors
operate at multiple voltages to produce multiple discrete states
(eigenstates).
The result could be a single device using just 10 electrons
and replacing up to 50 transistors. Benefits: faster, more
powerful processors producing far less heat. If, as Tsu believes,
the future of electronics will continue to depend on silicon for
the next 40 years or so, then he is right on target for betting
on (elemental) silicon devices rather than on compound materials
such as gallium arsenide or aluminum gallium arsenide.
Tsu conceives of a two-monolayer composite design employing
silicon plus silica, alumina, or calcium fluoride as barrier
materials for functional transistors dimensionally restricted to
planes (2D), wires (1D) or quantum dots (0D). Preference: quantum
dots and silicon/silica system, since layers can be built up by
exposing silicon to oxygen at elevated temperatures, then forming
the second silicon layer by known thin-film processes and
repeating the oxidation/silicon deposition steps.
Tsu believes prototype devices could become available in a
matter of months given the right combination of fabrication know-
how and less than $200,000 in funding. Commercialization will
take place through Profile Diagnostics, Inc., a NY-based R&D
company affiliated with Tsu.
Details: Dr. C.G. Wang, Profile Diagnostics, Inc., 510 E.
73rd St., 2nd Fl., New York, NY 10021. Phone: 212-249-1940. Fax:
212-249-4021.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ER930608
2081893
FASTEST TELECOM LASERS
Researchers at AT&T Bell Laboratories report fabrication of
two of the world's fastest telecommunications lasers. Both
lasers, made of gallium-indium-arsenide-phosphide on indium-
phosphide substrate, operate at 1.55 microns -- in the infrared
- -- which matches the wavelength of optical fiber amplifiers used
to boost lightwave signals in modern fiber-optic transmission.
The single-mode laser, which operates at a single wavelength
(color), turns on and off 22.5 billion times a second. The design
will allow transmissions over tens of kilometers, approximately
the range of high-capacity local telecom distribution networks.
Its speed represents a significant improvement over the 16 GHz to
18 Ghz plateau reached almost five years ago for single-mode
lasers.
At the ultra high rate of 25 billion Hz, the multimode laser
only functions at very short distances, up to several hundred
meters. The best that multimode lasers previously achieved
operated at 24 Ghz, but at the less desirable wavelength of 1.3
microns.
When commercialized, which could take two years or more, the
experimental multiple quantum-well devices will pave the way for
high-speed data and video communications over short and medium
distances. In quantum wells, electrons are restricted to
extremely thin semiconductor layers about 10-atoms thick, or
1/25,000th the width of a human hair.
Details: Russ Glover, AT&T, Rm. 3A303, 600 Mountain Rd.,
Murray Hill, NJ 07974-0636. Phone: 908-582-4768. Fax: 908-582-
4026.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ER930613
2081893
COMPACT LASER TUNABLE OVER VISIBLE SPECTRUM
Lawrence Livermore researchers have combined, for the first
time, tunability, high power, ultra-short pulses, and compactness
in a single laser. The device, conceived and designed by a
Livermore group headed by Dr. Steven Velsko, is protected by
several patents. The lab is looking for partners with funds to
commercialize complete the laser system, within two years, for
military and environmental sensing. Look for applications in
environmental chemical sensing (NOx, SOx, water vapor).
Livermore's tunable design assures versatility for a wide range
of remote sensing applications.
The laser operates at better than 100 W at a wavelength of
0.53 micron from a single-element, diode-pumped neodymium:YAG
slab power oscillator, frequency-doubled through single crystal
potassium titanyl phosphate. For frequency doubling, the power
oscillator operates at 2.5 Khz and delivers 26-nsec pulses in a
multitransverse mode beam. Conversion efficiency was 47%. What
makes nsec pulses possible in compact laser: novel,
birefringence-compensated Pockels cell operating at over 0.5
Kw/cm2, power level that was previously thought unfeasible.
Details: Dr. George Albrecht, Program Manager, Lawrence
Livermore National Laboratory, Box 5508, L-495, Livermore, CA
94550. Phone: 510-422-3358. Fax: 510-423-7562.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ER930615
2081893
SOL-GEL FRESNEL LENS KEY TO LASER COMMUNICATIONS
Geltech, Inc., has been awarded a $65,000 Phase I Small
Business Administration Innovation Research (SBIR) grant from the
Strategic Defense Initiative Organization to make 1.5-in. silica
Fresnel lenses through its patented sol-gel process. Fresnel
lenses, with one face cut into a series of steps or grooves, have
short focal length and are used in a variety of light projectors.
All Fresnels are currently made of plastics, however --
unsuitable for use in space, where they would be ruined by
radiation and out-gassing.
Geltech believes it can use its sol-gel process to make high-
grade silica glass lenses for use in ultraviolet or infrared
transmission that will withstand space conditions. But the sky
will not be the limit for this new fabrication technique. If bugs
can be worked out, look for applications in terrestrial optics,
including silica microoptics, microlens arrays, gratings, and
binary optics.
Sol-gel technology, licensed from University of Florida,
affords near-net shape or net-shape casting of specialty glasses
at room temperature with high homogeneity and purity using
ultrapure, off-the-shelf, optical-grade precursors. Geltech, also
awarded SBIR to develop prototype glass host dye laser through
sol-gel, is looking for industrial R&D partners.
Details: Dr. Jean-Luc Nogues, Geltech, Inc., 1 Progress
Blvd., Box 8, Alachua, FL 32615. Phone: 904-462-2358. Fax: 904-
462-2993.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ER930617
2081893
MOVING IMAGE TRACKING SYSTEMS
Nippon Telegraph and Telephone Corp. scientists have combined
a large-scale integration (LSI) processor with novel automatic
visual tracking system that will usher in a host of consumer and
industrial applications. Near term: video phones, fiber-optic
"universities," and games. Two to three years away: industrial
vision systems for manufacturing and security. The system works
by calculating the center of gravity of the target object within
the framework of the surrounding area. The target is recognized
through the difference in pixel brightness between it and the
background.
A proprietary local spiral labeling algorithm is used to
avoid a false inclusion of background pixels having the same
light value as the target; a content-addressable memory (CAM, as
in CAM-Corder) parallel procesor allows high-speed processing to
conform to 1/30th-sec image refresh rate.
Details: Kenya Natatsuka, Nippon Telegraph and Telephone
Corp., 1-6 Uchisaiwai-cho, 1-Chome Chiyoda-ku, Tokyo 100, Japan.
Phone: +81 3 3509 3101.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EM930617
110993
MONITOR EPITAXIAL FILM GROWTH
The US Air Force would like to transfer a new, patented
optical sensor system to monitor epitaxial film growth. Potential
uses lie in molecular beam epitaxy, organometallic CVD, and
sputtering for the production of microelectronic, microwave, and
optical devices.
The new system provides much faster feedback on film
composition and feedback. Unlike conventional sensors, which
mostly track effusion cell or substrate temperature, the new
system uses faster, more accurate spectroscopic ellipsometry to
monitor film characteristics. Spectroscopic ellipsometry measures
changes in polarized light reflected off or transmitted through a
growing film. As films grow, sensor response varies with
refractive index, thickness, composition, and roughness.
The Air Force has used the sensor to monitor low-temperature
growth of GaAs on GaAs, and to track aluminum arsenide and indium
arsenide deposition on GaAs and InP substrates. The researchers
hope to improve real-time feedback and process control by
simplifying the nonlinear equations that evaluate incoming data.
Details: Kurt B. Eyenk, Project Engineer, Wl/M1BN, Bldg. 652,
Rm. 131, Wright-Patterson AFB, Dayton, OH 45433. Phone: 513-255-
3625. Fax: 513-255-5375.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EM930618
110993
CHEAP THICK-FILM SUPERCONDUCTORS
High-temperature superconductors offer better receiver
sensitivity, signal/noise ratio, frequency stability, and dynamic
range in wireless telecommunications. So far, HTc superconductor
epitaxial thin films cost too much to make into the complex
devices used in advanced radio systems. The solution, according
to Illinois Superconductor Corp. (ISC), may lie in thick films
(usually 1-2-3 but sometimes BSCO) on cheap substrates. Possible
applications include cellular phones, interactive TV, airline
communication, Doppler (wind-shear) radar, and satellite
communications. ISC has applied for patents and plans to
manufacture components and systems. It welcomes joint application
development inquiries.
ISC uses stainless steel rather than more common ceramic
substrates. Like ceramics, stainless matches 1-2-3 thermal
expansion rates, and it costs less to make and shape into 3D
structures. The company first coats the steel with a proprietary
buffer base layer, then deposits 1-2-3 slurry on the substrate by
dip, screen, or other common electronic coating methods.
ISC has several resonant cavities that achieve Q factors of
more than 800,000. That's 20 times better than copper and 40
times better than other planar technologies. Backed by National
Institute of Standards and Technology funding, ISC has joined
with AT&T Bell Laboratories and Ameritech Mobile Communications
to demonstrate thick-film feasibility in a cellular base-station
receivers.
Details: Steve Wasko, Illinois Superconductor Corp., 1840 Oak
Ave., Evanston IL 60201. Phone: 708-866-0435. Fax: 708-866-0439.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EA930596
40893
SINGLE-MASK PROCESS BUILDS MICRORESONATOR
A single-mask, single-crystal silicon (SCS) process -- Scream
I (single crystal reactive etching and metallization I) --
fabricates microelectromechanical structures (MEMS). The process,
developed by researchers Kevin Shaw, Lisa Zhang, and Noel
MacDonald at Cornell's Nanofabrication Facility, fabricates a
complete working microresonator -- including contact pads,
interconnects, drive electrodes, and moving structures -- with a
single mask.
Since the process is self-aligned, its metallization step
defines all electrical elements without the need for subsequent
photolithography. Scream I works at low temperatures (>300
degrees C), and requires less than 6 hr of processing time,
allowing it to be integrated with completed integrated circuits
(IC).
The researchers have fabricated completely metallized
micromechanical structures with aspect ratios of 10:1 with
minimum features of 1 micrometer. They can build structures 0.5
micrometer to 5.0 micrometer in width using standard industrial
IC fabrication equipment. The process is available for licensing.
The Scream I process is a dry-bulk micromachining process.
The researchers begin by lithographically patterning a thick
oxide mask. A deep chlorine etch of the silicon substrate left
exposed by the mask generates the high-aspect ratio SCS
structures. They apply a conformal oxide coating using plasma
enhanced chemical vapor deposition (PECVD). A fluorine reactive
ion etching (RIE) then anisotropically removes the oxide from the
trench floor. This etch step leaves the structures with the mask
oxide extant on the top surface, the PECVD oxide on the sidewall,
and bare silicon on the trench bottom. Using a high pressure
fluorine RIE, the researchers then etch the silicon out from
under the structures, thus releasing them. As the final step,
they sputter metallize the wafer. The undercut nature of the
second fluorine RIE step automatically isolates the metallization
on each separate section of the structure.
Details: (Cite project 236-85) Kevin A. Shaw, School of
Electrical Engineering and the National Nanofabrication Facility,
Cornell University, Ithaca, NY 14853. Phone: 607-255-4109. Fax:
607-255-1001. Licensing: Richard S. Cahoon, Cornell Research
Foundation, Inc., Cornell Business and Technology Park, 20
Thornwood Dr., Ste. 105, Ithaca, NY 14850. Phone: 607-257-1081.
Fax: 607-257-1015.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EA930599
40893
DESIGN LOW-NOISE, LOW-DRIFT ELECTRONICS
A dedicated, programmable Seebeck Effect Measurement system,
developed by researchers at MMR Technologies, allows fabricators
and researchers to determine the Seebeck or thermal voltage of
metals, organics, semiconductors, superconductors, and other
electrically conducting ceramic materials. The SB100 unit
automatically studies samples over a temperature range from 80 K
to 400 K with a resolution of 50 nV.
The unit's Seebeck thermal stage includes two pairs of
thermocouples. One pair is formed of junctions of copper and a
reference material of known Seebeck Effect properties. The other
pair is formed of copper and the material whose Seebeck Effect
properties are to be determined. The system uses a parametric
double reference measurement technique developed at MMR to obtain
the results.
Fabricators use such measurements to design low-noise, low-
drift electronics. The data provides insight into the
characteristics of superconductors, semiconductors, organics, and
materials exhibiting the metal-insulator transition. It's also
useful for studies of novel Peltier cooler compounds.
The system includes computer-controlled measurement
electronics, a cryogenic system, a temperature controller,
computer, and software. A package of disposable sample stages
allows rapid measurements of the properties of different
materials without fear of contaminating one with the other.
Details: Robert L. Paugh, MMR Technologies, Inc., 1400 N.
Shoreline Blvd., Ste. A-5, Mountain View, CA 94043-1312. Phone:
415-962-9620. Fax: 415-962-9647.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EA930602
40893
WRIGHT LAB OFFERS 150-KW CO2 LASER FOR INDUSTRY USE
Private industry can now use the US Air Force Wright
Laboratory facility which houses the largest carbon dioxide (CO2)
laser in the United States. The Laser Hardened Materials
Evaluation Laboratory (LHMEL) has tested and characterized Air
Force materials in support of national defense programs and the
aerospace industry for 17 years. The facility features two CO2
laser systems, both of which were designed and produced by
personnel in the laboratory's Materials Directorate.
With the lasers are chambers, wind tunnels, and mechanical
loading machines which simulate various operational environments
for aerospace systems. Extensive diagnostic, measurement, and
data-acquisition systems collect and process the information
generated by lasers.
The diversity and availability of the LHMEL facility provide
unique technology transfer opportunities for commercial
organizations, especially those involved with welding, cutting,
and heat treatment of metals. The current usage fee is $9000/day
for LHMEL II and $3200/day for LHMEL I. Lawrence Associates
(Dayton, OH) provides operational support services to LHMEL.
LHMEL I laser produces 15 kW of continuous-wave (CW) output
power in a 9-cm dia beam. The LHMEL II laser provides a 17-cm dia
beam having 150 kW of CW output power for durations up to 100
sec.
Details: Rob Hull, WL/MLPJ Bldg. 651, 3005 P St., Ste. 1,
Wright-Patterson AFB, OH 45433-7702. Phone: 513-255-4588.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
END OF FILE
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ADVANCES IN ELECTRONICS TECHNOLOGY
TECHNICAL INSIGHTS ALERT
A Service from Technical Insights, Inc.
August 6, 1993
Copyright 1993, Technical Insights, Inc., Englewood, NJ USA
Phone: 201-568-4744
LICENSED FOR INTERNAL COMPANY USE ONLY
DISSEMINATION OUTSIDE OF THE COMPANY IS PROHIBITED
R930594 DIAMOND FOR FLAT-PANEL DISPLAYS
R930596 ELECTRONIC INTERFACES INTERFERE WITH PHOTONICS
R930599 DIFFRACTIVE OPTICAL MATERIAL FOR INTRAOCULAR
LENSES
R930602 INVISIBLE CIRCUITS FOR NEXT-GENERATION CHIP
EA930585 CIM SOFTWARE SPEEDS SEMICONDUCTOR MANUFACTURING
EA930589 MEASURE PROPERTIES OF MICROCHIP LINES
EA930593 CRADA WILL IMPROVE CVD MONITORING
EM930605 NEC MODELS Si3N4 CVD
EM930609 SMALLER SOURCE SPEEDS MAGNETRON SPUTTERING
***************************************************
To get further details on the advances noted below,
just call/write/fax the contact named
at the end of the briefing.
***************************************************
R930594
2081193
DIAMOND FOR FLAT-PANEL DISPLAYS
When the value of the market is $20 billion, which we expect
for flat-panel displays by 2000, look for technologies to
leapfrog each other. That is what researchers at SI Diamond
Technology, Inc. (SID), are doing by adapting their patented
amorphic diamond technology to flat-panel displays. SID has
received a $56,000 grant from ARPA (Advanced Research Programs
Agency) to improve amorphic diamond techniques and perhaps skip
over active matrix liquid crystals altogether. Another aspect of
the project will be developing spacers that maintain required
distance between diamond and phosphor-coated glass panels in
displays. If successfully applied to flat screens, amorphous
diamond will also propel SID to the forefront of flat-panel R&D,
ahead of such Japanese companies as Toshiba, Sharp, and NEC.
Current active matrix liquid crystal displays produce
distortion and dark images while consuming considerable energy.
Diamond greatly improves brightness and definition, while
reducing distortion and energy consumption. SID is looking for
additional R&D partners for amorphic diamond techniques,
especially for interconnects. The company was recently awarded
$52,000 from the Ballistic Missile Defense Organization on
"Liquid Metal Cluster Ion Source Technology for Repair of
Packaging Interconnects."
SID has also received a patent US 5,234,724, on its diamond
doping technique that the company hopes will lead to both n- and
p-type diamond semiconductors. So far SID has succeeded in
getting boron and sodium p-type doping, but is still working on
n-types. Diamond doping is difficult because the high-energy
impact of the doping process causes crystal lattice damage. Once
damage occurs, diamond hardness does not allow repair. The SID
technique uses low-temperature, low-energy implantation occurring
during diamond film growth. Sandwich technique allows gentle
incorporation of dopants into nascent diamond film as it forms.
SID is performing p-type doping as a commercial service, and will
look for partners for eventually using low-energy technique for
n-type diamond semiconductors.
Details: Howard K. Schmidt, Chief Operating Officer, SI
Diamond Technology, Inc., 2435 N. Blvd., Houston, TX 77098.
Phone: 713-529-9040. Fax: 713-529-1147.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
R930596
2081193
ELECTRONIC INTERFACES INTERFERE WITH PHOTONICS
Photonic devices offer many advantages over conventional
electronics, primary being immunity from electronic interference.
This was accepted as gospel until researchers at Georgia Tech
discovered that electronic immunity might have been overstated
and even misunderstood. At the core of the immunity question are
types of domains in which photonics and electronic operate.
Electrons run through wires, which are conductors, and lightwaves
travel through waveguides or fibers, which are insulators. Any
high school physics student knows the difference between conduc-
tors and insulators. But light beams in photonic systems
typically are modulated with electrical signals. These
electrical/electronic interfaces provide a way for
electromagnetic (EM) energy to sneak into a system, creating
potentially serious performance problems.
Working under a US Air Force grant, Georgia Tech researcher
John K. Daher subjected electrooptic, acoustooptic, magnetooptic,
and charge-coupled devices to radio frequency (RF) and microwave
fields, and also coupled potentially interfering signals directly
into photonic systems. Effects varied, but in an electrooptic
system RF energy caused heating of the optical waveguides, which
are highly sensitive to temperature. In nearly all cases, Daher
shut down the photonic component by judiciously tweaking the RF
or microwave energy.
Details: John K. Daher, Electromagnetic Environmental Effects
Laboratory, Georgia Institute of Technology, Atlanta, GA 30332.
Phone: 404-894-8228. Fax: 404-894-3906.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
R930599
2081193
DIFFRACTIVE OPTICAL MATERIAL FOR INTRAOCULAR LENSES
Lawrence Livermore National Laboratory (LLNL) has signed up
with Phoenix Laser Systems, Inc., to put novel diffractive
optical materials on the market within two years. Lenses made
from the new materials will be implanted under the surface of the
eye to correct every significant vision problem. Polymeric
diffractive optical materials were developed by Livermore
scientists, who were told of their potential medical uses by John
Stanley, an ophthalmologist at the University of California, San
Francisco. Livermore turned to Phoenix because of the company's
expertise in laser-based ocular surgery and sculpting.
Diffractive optics are related, in performance, to gradient
index optics in that they contain more than one optical element
per lens. Gradient index (as well as conventional) lenses work
because the lens material has a different refractive index from
the medium, usually air. Diffractive optics use microscopic
slits, lines, or grooves to bend light. Diffraction has not,
until now, been suitable for vision correction because colors
tend to separate out. The new materials overcome this problem due
to their thinness and physical characteristics.
Diffraction lenses are less than 100 microns thick -- thinner
than the width of a human hair. After removing the patient's
lens, diffraction lenses are inserted by either rolling them up
and pushing them through a mm-sized hole in the eye, or by
slicing a thin layer of cells off the ocular surface, placing the
microlens over the cornea, and inducing the epithelial cells to
grow back.
Phoenix Laser will be responsible for the lens' optical
performance, evaluation of biological and human compatibility,
securing FDA approval, and developing associated surgical
techniques. Livermore will continue working on optical
development, fabrication, demonstration, and possibly securing
other contracts in industrial optics. Phoenix's first target is
presbyopia (inability to vary eye's focal length, requiring
bifocals), followed by hyperopia (farsightedness) and myopia
(nearsightedness).
The cooperative research and development deal, worth $15
million, is second largest CRADA (Cooperative Research and
Development Agreement) signed by LLNL.
Details: Joann Schulz, President, Phoenix Laser Systems, 4127
Bay St. No. C-210, Fremont, CA 94838. Phone: 510-249-0300. Fax:
510-249-0310.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
R930602
2081193
INVISIBLE CIRCUITS FOR NEXT-GENERATION CHIP
Billion-transistor-on-a-chip devices, enabling next-
generation computing, will not be possible without the next-
generation chip printing technology under development at
Louisiana State University's (LSU) super microchip center.
Researcher Yuli Vladimirsky and coworkers have received a $1.3-
million Army grant to perfect an X-ray system that prints
subvisible circuit lines. Vladimirsky and colleague Martin
Feldman will supervise work at Anorad Corp. (Hauppague, NY) and
Anvik Co. (Elmsford, NY) on the highly precise vertical alignment
system to be installed in LSU's existing $800,000 robotic, high-
precision exposure tool, a type of X-ray camera used to print
lines in thin films. Eventually, the camera will accept high-
energy light piped in via stainless beam line coming from LSU's
$20 million electron accelerator.
All lithography is limited by the wavelength of the radiation
used, but X-rays have the shortest wavelength of any useful
energy, hence are capable of the finest detail. Because X-rays
are also highly energetic, they penetrate organic materials and
most dust in clean rooms, greatly reducing the rate of chip
defects. Researchers can now print on single layers of substrate,
but their goal is multiple layers required by complex circuitry.
The patenting situation on entire chip-making system is
unclear, since so many discrete pieces will eventually go into
it. Alignment work appears to be closed to Anorad and Anvik, but
fabrication should be open to joint ventures with industry and
universities.
Details: Yuli Vladimirsky, Center for Advanced
Microstructures and Devices, Louisiana State University, Baton
Rouge, LA 70803. Phone: 504-388-4618 (office), 504-925-7070, ext.
222 (lab).
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
A930585
40893
CIM SOFTWARE SPEEDS SEMICONDUCTOR MANUFACTURING
A computer-integrated manufacturing (CIM) software product --
Works from Texas Instruments (TI) -- addresses key semiconductor
business issues, including costs, quality, cycle time and
flexibility. Works enables companies to shift from mass
manufacturing to more flexible, agile production methods. Its
emphasis is on reducing the cycle time from months to days, with
the intent of doubling equipment productivity and yield. TI
engineers, using the new software, manufactured a semiconductor
over a three-day production cycle.
Works software was developed under a five-year, $86-million
Microelectronics Manufacturing Science and Technology (MMST)
program involving TI, the US Advanced Research Projects Agency
(ARPA), and the US Air Force Wright Laboratory. The MMST
reengineered-wafer-fabrication process greatly reduces the number
of material movement operations, resulting in significantly
shorter cycle times and increased productivity. In 1992,
Sematech, a nonprofit research consortium, awarded TI a contract
to codevelop and implement an industry-standard-software
framework for CIM. Works is the commercialized version of the
MMST-CIM software. The Works software system costs about $350,000
for a small fabrication plant and about $2 million for a high-
volume facility.
Works's seven application modules allow for planning,
scheduling, specification, and realtime control of the
manufacturing process. With Works, manufacturers control the
wafer-fabrication process in realtime, achieving greater customer
responsiveness and reduced work-in-process (WIP) through cost-
effective, agile manufacturing capabilities. Works also provides
what-if scenario analysis through its simulation capability to
preview the impact of potential changes to the production
process.
Other industries that could use Works include electronic
components, chemical, pharmaceutical, automotive, and other
manufacturing sectors.
Details: Bob Dorn, Texas Instruments, Inc., 6550 Chase Oaks
Blvd., PO Box 869305, MS 8412, Plano, TX 75203. Phone: 214-575-
2094. Fax: 214-575-6810.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
A930589
40893
MEASURE PROPERTIES OF MICROCHIP LINES
A calibration-comparison method (CCM), developed by National
Institute of Standards and Technology (NIST) scientists, measures
the electrical properties of planar-transmission lines on a
microchip. The technique examines the characteristic impedance of
the lines as well as their resistance, inductance, capacitance,
and conductance per unit length. The scientists find they can use
the method to characterize transmission lines fabricated on
polymers, silicon, or other lossy (or dispersive) dielectrics. It
has far greater accuracy than conventional procedures, having
been demonstrated in the laboratory on frequencies ranging from
50 Mhz to 40 GHz. Applications at higher and lower frequencies
are possible. Fabricators should find the calibration-comparison
method useful in the evaluation of microwave-integrated circuits,
digital-integrated circuits, printed-circuit boards, and high-
density packaging for high-performance computing.
Details: (Cite paper 17-19), Sarabeth Moynihan, Div. 104,
National Institute of Standards and Technology, Boulder, CO
80303-3328. Phone: 303-497-3237.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
A930593
80993
CRADA WILL IMPROVE CVD MONITORING
Morton International Advanced Materials has teamed with the
National Institute of Standards and Technology (NIST) to develop
a system to monitor and measure, in situ and in real time,
metalorganic vapors flowing through chemical vapor deposition
(CVD) reactors. Metal-organic CVD is used to fabricate compound
semiconductors and detectors used in laser diodes, high electron
mobility devices, infrared detectors, and solar cells. The
collaboration will result in an all-purpose CVD monitoring
process that will eventually be available for licensing;
patenting would only occur if Morton and NIST can put together an
integrated system which, according to chief Morton scientist Dr.
Ravi Kanjolia, is a long way off.
The monitoring technique will be based on Fourier-transform
(FTIR) infrared analysis of groups III-V (gallium arsenide,
indium phosphide, aluminum gallium arsenide) and groups II-VI
(cadmium telluride, mercury cadmium telluride, zinc sulfide, and
zinc sulfur selenide). The FTIR technique will actually look at
the metal-organic precursors of compound semiconductor materials,
such as trimethyl gallium, trimethyl arsenic, and tributyl
arsenic. Early on, Kanjolia and coworkers will look for unique
FTIR peaks in CVD precursors, then use this information in an
actual reactor connected to fast FTIR instrumentation.
Details: Dr. Ravi Kanjolia, Morton International Advanced
Materials, 148 Andover St., Danvers, MA 01923. Phone: 508-750-
9490. Fax: 508-750-4298.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
M930605
110993
NEC MODELS Si3N4 CVD
Time lies at the crux of the race to build 256 megabyte (MB)
dynamic random access memory (DRAM) or computers. To speed time
to market, Japanese engineers have borrowed a technique at which
US researchers excel: simulation modeling. Eschewing their more
typical collection of experimental data, scientists at NEC have
developed a molecular orbital model that uses surface reaction
probability and Monte Carlo methods to simulate silicon nitride
film growth and shape.
NEC uses the model to fabricate fine, uniformly thick Si34
films for capacitors for 256 MB DRAMs. The model shows several
important interactions in the high-temperature reaction of
dichlorosilane and ammonia. Researchers find they create better
stepped Si3N4 coatings with lower dichlorosilane content, but
this also reduces deposition speed. Lowering dichlorosilane
content and CVD temperatures forms poor films.
On the other hand, hydrochloric acid (a reaction byproduct)
suppresses surface reactions and boosts coating energy levels.
NEC plans to apply similar models to other processes in an effort
to cut development time for advanced electronic devices.
Details: NEC Corp., 5-7-1, Shiba, Minato-ku, Tokyo 108-01,
Japan. Phone: +81-3-3454-1111. Fax: +81-3-3457-7249.
xxx
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
M930609
110993
SMALLER SOURCE SPEEDS MAGNETRON SPUTTERING
Lawrence Livermore National Laboratory (LLNL) and US Thin
Film Products have combined to introduce a smaller, more
reliable, and less expensive magnetron sputtering system. LLNL's
Dan Makowiecki, who named the system the "Mighty MAK," developed
it for flexible deposition of complex multilayer coatings for X-
ray optic experiments. Commercial uses include active and
protective coatings for compact disks and integrated circuits.
The key to the system's performance is the incorporation of
aluminum nitride in the cathode design. AlN's high thermal
conductivity removes so much unwanted process heat, it eliminates
the need for water cooling and simplifies unit construction. The
Might MAK comes in two sizes, 1.3 in. and 3.0 in. The 1.3-in.
source achieves superior uniformity at coating rates equivalent
to 2.0-in. systems operating at the same power levels.
The 1.3-in. system also operates at pressures twice as high
as other commercial sputter sources, which makes it a natural for
deposition of high-temperature superconductors and other
ceramics. Its small size permits installation of more sources in
a single vacuum chamber, while its simplified design boosts
reliability and reduces manufacturing cost. US Thin Film plans to
sell the 1.3-in. source for less than $3000, and the 3-in.
source, under $4300. US Thin Film expects to sell 250 units the
first year of production.
Details: Dan Makowiecki, Group Leader, Mail Stop L369, PO Box
808, Lawrence Livermore National Laboratory, Livermore CA 94551.
Phone: 510-422-5794. Licensing: Gib Marguth, Technology Transfer
Initiatives Program, Lawrence Livermore Laboratory, L795, same
address as above. Phone: 510-423-1341.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
END OF FILE
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ADVANCES IN ELECTRONICS TECHNOLOGY
TECHNICAL INSIGHTS ALERT
A Service from Technical Insights, Inc.
July 30, 1993
Copyright 1993, Technical Insights, Inc., Englewood, NJ USA
Phone: 201-568-4744
LICENSED FOR INTERNAL COMPANY USE ONLY
DISSEMINATION OUTSIDE OF THE COMPANY IS PROHIBITED
ER930582 INTEGRATED HIGH-TC SUPERCONDUCTOR SYSTEM
ER930586 DIAMOND ELECTRONICS MONITOR
ER930590 MAGNETRON SPUTTERING
ER930593 COMPANY TO WATCH: CAD FORMS TECHNOLOGY, INC. --
For Digital Pens
EM930595 FILLERS IMPROVE RESIN CONDUCTIVITY
EM930599 LOW-TEMPERATURE ITO FILM ROUTE
EA930574 IC SENSORS, NEC ACCELEROMETER VENTURE
EA930575 FLEXIBLE-EXCISE-AND-LEAD-FORM PROCESS ELIMINATES
NEED FOR CUSTOM TOOLS
EA930576 UNIVERSAL SENSOR INTERFACE
EA930577 OPTICAL SWITCHING
***************************************************
To get further details on the advances noted below,
just call/write/fax the contact named
at the end of the briefing.
***************************************************
ER930582
2080493
INTEGRATED HIGH-TC SUPERCONDUCTOR SYSTEM
A prototype fully integrated device using high-temperature
superconducting (HTS) coils has been delivered to the US Navy.
The acoustic transducer creates high-powered sound for better
sonar capabilities in shallow ocean locations such as beaches or
the Persian Gulf. The superconducting sonar will enable more
sophisticated signal processing and signature recognition and,
aside from its military uses, will find future applications in
such things as oil exploration and ocean mapping.
More important, it is the first of a string of prototypes
you'll see over the next six years -- some as soon as two years
from now -- beginning to bring some of the big superconductor
applications in: electric power generators half the size,
electric motors with the same size reduction plus a reduction of
energy losses by as much as 60%. We seem to be moving faster than
expected toward actual high-temperature superconductor devices --
the sonar system is two years ahead of schedule.
In two years you can expect a prototype of what may be the
first major power system application, a triggerable current
limiter to keep power surges too big for present circuit breakers
to handle from destroying transformers and other equipment.
The sonar system delivered by American Superconductor has
been successfully tested at depths up to 100 ft. The delivered
package combines superconducting coils with the cryogenic
refrigeration and electronics required to operate the system. The
prototype uses AC current, demonstrating that the HTS materials
work well in the big AC applications. The cryogenic refrigerator,
supplied by Carrier, is a Stirling-cycle cryocooler which keeps
the HTS coils at 50 K to 70 K without liquid coolants. The device
also incorporates an advanced magnetostrictive material to
convert electric power into acoustic power.
Details: Gregory J. Yurek, President and CEO, American
Superconductor Corp., 2 Technology Dr., Westborough, MA 01581.
Phone: 508-836-4200.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ER930586
2080493
DIAMOND ELECTRONICS MONITOR
Commercial development is beginning at Advanced Technology
Materials (ATM) on the first portable fiber-optic X-ray
diffraction (XRD) system for in-situ monitoring of diamond thin
films created through chemical vapor deposition (CVD). When it is
available -- ATM has a prototype and just needs to set up
manufacturing -- companies will be able to eliminate consecutive
materials tests and costly post-test analyses by putting
sequences of materials measurements into one testing session.
Constant monitoring will also reduce the risk of material
rejection by permitting ongoing adjustment of conditions. The
development of better diamond thin-film technology will be
critical in manufacturing diamond cold cathodes for high-
resolution, low-power flat-panel displays.
Prior to development of the system, engineers could only
monitor basic process conditions such as temperature, pressure,
and flow rates. Realtime X-ray monitoring of critical
compositional and microstructural information is a first step
toward intelligent processing. The XRD device is a position-
sensitive scintillation detector based on fiber optics. It was
modified by ATM for use in a reactor environment to simul-
taneously measure critical film parameters including phase
composition, degree crystallinity, texture (preferred
orientation), thickness and residual stress.
Details: Dave Kurtz, Manager of Process Control Equipment,
Advanced Technology Materials, Inc., 7 Commerce Dr., Danbury, CT
06810. Phone: 203-794-1100. Fax: 203-792-8040.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ER930590
2080493
MAGNETRON SPUTTERING
Machinery for a new concept in magnetron sputtering, the
fabrication process used to coat compact disks and integrated
circuits, is going into production at US Thin Film Products. The
small coating source was developed at Lawrence Livermore in
response to changing needs for depositing complex multiple layer
coatings used in X-ray optic experiments.
Size is the advantage. You can increase the number of sources
you can install in small places: Five of the devices can be
placed in a 12-in. vacuum bell jar. You can quickly modify the
system to make different things. Or you can gang sources together
to coat large areas. The other advantage is reliability because
there is no high temperature problem. The 1.3-in. source has a
coating rate comparable to commercial 2-in. sources operating at
similar power levels, which results in better uniformity in
coating thickness. The 1.3-in. source also has an operating
pressure that is twice as high as other commercial sources. This
makes it good for depositing thin films of high-temperature
superconducting material. The company has started to ship 1.3-in.
units and is going into production with the 3-in. unit.
Details: Herb Kott, President, US Thin Film Products, Inc.,
1999 S. Bascom Ave., Ste. 405, Campbell, CA 95008. Phone: 408-
371-6900.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
ER930593
2080493
COMPANY TO WATCH: CAD FORMS TECHNOLOGY, INC. -- For Digital Pens
Pen Station, a docking device to collect data from notepad
computers and transmit it to a host computer system, is the
product of CAD Forms Technology. Pen Station puts the company
into a good strategic position in the hottest action in computers
right now.
Opportunities. The market for pen-based computers is one of
the fastest growing segments of the computer industry. While
personal computer sales grew at a rate of only 5% in 1991, those
of pen computers are expected to climb from an estimated 75,000
units in 1992 to 3 million units, or $7.4 billion, in 1995.
Technology. Pen Station collects the data from the pen and
puts it into the host computer system. Notepad computers are
portable data-gathering devices that use a penlike stylus to
enter information directly onto a screen, rather than using a
keyboard. Common users include power utility companies whose work
crews use the devices for on-site data entry.
Company Status. The company has been a development-stage
operation since its founding and is now positioned to take
advantage of its product development program and begin
commercialization of the Pen Station. CAD Forms Technology
currently employs six full-time and four part-time people, and
projects employment of 155 in 1998. The company has received
$200,000 in funding from New York State's Corporation for
Innovation Development program.
Company Background. Founded in November 1989 by John
Notarianni, CEO. He has 10 years experience in systems
integration and design, including five years with Grumman
Aerospace, where he was responsible for a variety of design
modifications for the F-14A to F-14A-Plus military fighter
aircraft. Dwight Devon, executive vice president and director,
has had considerable experience building start-up companies into
profitable operations, including PC Systems Plus, and Devon
Stores, Inc.
Details. CAD Forms Technology, Inc., 174 Glen Cove Rd., Carle
Place, NY 11514. Phone: 516-248-0915.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EM930595
70993
FILLERS IMPROVE RESIN CONDUCTIVITY
Heat buildup remains the enemy of high-density integrated
circuits, and the use of resin makes the problem worse.
Manufacturers favor resins for encapsulants, passivating layers,
and die attach adhesives. They cost relatively little, go on
easily, and show superior dielectric strength (for closer
interconnect placement). Unfortunately, plastics have poor
thermal conductivity, which exacerbates any difference in thermal
expansion coefficients (CTEs). Ceramics and diamond offer better
thermal conductivity, but application costs run high.
The solution may lie in ceramic-filled resin composites, such
as one developed by Deborah Chung of State University of New York
(SUNY) at Buffalo. Chung starts with a polyimide matrix with
thermal conductivity of 0.128 W/m/degree C. Adding 50 vol %
silicon carbide whiskers lifts that to 1.26 W/m/degree C, while
50 vol % aluminum nitride particulates brings conductivity to
1.76 W/m/degree C. A 50 vol % 1:3 SiC:AlN mixture does even
better, boosting conductivity 2.23 W/m/degree C.
Chung believes the SiC whiskers act as bridges to connect the
more conductive AlN particles. The whiskers also serve to improve
composite toughness and reduce CTE. While neat polyimide has a
CTE of 81 x 10(exp -6), the whisker/particulate mixture drops the
CTE to 13 x 10(exp -6). The Advanced Research Projects Agency
(ARPA) and SUNY Buffalo supported the research.
Details: Deborah D.L. Chung, Composite Materials Research
Laboratory, SUNY Buffalo, Box 604400, Buffalo, NY 14260-4400.
Phone: 716-645-2520. Fax: 716-645-3875.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EM930599
110993
LOW-TEMPERATURE ITO FILM ROUTE
Indium-tin-oxide (ITO) thin films have a combination of
transparency and electrical conductivity that makes them ideal
for large-area display panel electrodes. In the past, developers
could match resistivity to their requirements only by heating the
substrate to 200 degrees C. This eliminated polymers from
consideration as substrates. A new Japanese process makes it
possible to control electrical and optical characteristics at
deposition temperatures as low as 50 degree C.
Researchers at the Osaka Industrial Technology Research
Institute and the Ion Engineering Research Institute combined to
produce an ITO film with 80% transmissivity at 550 nm and 7.0 x
10(exp -4) omega-cm.
The team made the film with a dual ion beam sputtering
system. It uses argon to sputter a target (in the past, an In-
10Sn alloy) onto the substrate, and a low-energy oxygen source to
irradiate the film. By varying the radiation intensities of both
ion streams, researchers could continuously alter the
transmissivity and conductivity of the film at relatively low
temperatures.
Details: Osaka Industrial Technology Research Institute,
Electronic Device Laboratory, Materials Technology Section, 2-1-
53, Enokojima, Nishi-ku, Osaka 550, Japan. Phone: +81-6-443-1121.
Fax: +81-6-443-3137.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EA930574
80993
IC SENSORS, NEC ACCELEROMETER VENTURE
IC Sensors (ICS) and NEC Technologies, Inc., have joined
forces to produce silicon micromachined accelerometers for NEC's
fully electronic single-point air bag controller. ICS's
micromachined accelerometer has several advantages over
conventional multipoint systems, which rely on input from a
number of electromechanical switches placed at different points
around the car. Conventional sensors can only send a simple
on/off signal, while the single-point accelerometer employs a
continuous flow of motion information to the air bag control
unit. This enables the controller to monitor and evaluate the
car's movement constantly, and more accurately determine the need
to trigger the air bag. Single-point sensors are also inherently
cheaper to build and install.
The ICS accelerometer measures 0.3 sq in. x 0.14 in. high and
weighs three grams. Other automotive applications include
suspension control and antilock braking.
Details: Richard A. Auxer, ICS, 1701 McCarthy Blvd.,
Milpitas, CA 95035. Phone: 408-432-1800. Fax: 408-432-7322.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
xxx
EA930575
40893
FLEXIBLE-EXCISE-AND-LEAD-FORM PROCESS ELIMINATES NEED FOR CUSTOM
TOOLS
Patented flexible-excise-and-lead-form (FELF) technology
speeds up the assembly process for chip-on-tape devices.
Developed by researchers at the Microelectronics and Computer
Technology Corp. (MCC), the FELF process has been licensed to
Accu-Fab Systems, Inc. (Corvallis, OR) for use in commercial
excise-and-lead-form equipment. The first order is scheduled for
delivery. Other licenses are possible.
The excise-and-lead-form process removes the device from the
tape and forms the leads in preparation for surface mount to a
substrate, package, or board. The conventional method requires
the custom design and fabrication of several specific tools for
various device sizes and lead-form geometries. These expensive,
long-lead-time tools require considerable production downtime for
tooling changeover.
MCC's FELF technology eliminates the need for customized
tooling. FELF combines inexpensive, flexible tooling with
computer-controlled processes to accommodate a variety of
semiconductor-chip sizes and beam-tape geometries.
FELF technology replaces the commonly used custom-punch-and-
die set, which is designed specifically for individual devices.
The FELF set consists of generic "one size fits many" tooling
controlled by a parametrically based software program. Using the
FELF method, you can produce virtually any lead form simply by
manipulating software parameters. For example, the FELF software
program can change the size of the outer-lead-bond (OLB) foot
print to accommodate various OLB patterns on a substrate. It can
increase or decrease the height of the lead form according to the
varying thickness of the die or die attach. It can change the
shape of the lead form to accommodate square or rectangular
devices. In addition, the FELF method can produce a lead form
face-up, face-down, with or without keeper bars.
The FELF tooling set is about 10% of the tooling cost
required by conventional excise-and-lead-form technologies. In
addition, the FELF-software program operates on Microsoft Windows
and requires minimal training.
Details: Bill Stotesbery, Microelectronics and Computer
Technology Corp. (MCC), 3500 W. Balcones Center Dr., Austin, TX
78759-6509. Phone: 512-338-3785. Neal Pierce, President, Accu-Fab
Systems, 33854 Eastgate Cir., Corvallis, OR 97333. Phone: 503-
758-3329. Fax: 503-758-9022.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EA930576
80993
UNIVERSAL SENSOR INTERFACE
ERA Technology, a leading British sensors consulting and
engineering firm, is participating in a major European project to
develop universal interfaces for application-specific integrated
circuits (ASICs). ASICs are of particular interest to industries
involved in sensors and other custom microprocessors. The goal of
the program is to combine high-performance analog functions with
high resolution through development of a universal sensor
interface integrated circuit (USIC), which ERA will define,
design, and characterize.
ERA expects the USIC to interface with a variety of sensors
and sensor inputs (mixed analog and digital), incorporate digital
offset, span and linearization, and provide a variety of outputs.
So far ERA has consulted with over 300 companies on the USIC
project. Specifications for the new device will be released
within a few weeks.
Details: Paul Wilson, ERA Technology Ltd., Cleeve Rd.,
Leatherhead, Surrey KT22 7SA, UK. Phone: +44 372 374 151, ext.
2244. Fax: +44 372 377 927.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
EA930577
80993
OPTICAL SWITCHING
Optical fibers transmit about 1000 times as much data as
coaxial cables using electrical signals. But conventional
electrooptics suffer from having an electrical weak link which
slows down performance. Inexpensive, versatile, all-optical
switches are not yet commercial, but improvements on a new
switching module by Nippon Telegraph and Telephone Corp. (NTT)
could change that very soon.
NTT has developed a compact, low-crosstalk 8 x 8 optical
matrix switch chip utilizing silica-based planar lightwave
circuits and an optical switch module integrating the chip with
its driving circuitry. Planar lightwave circuits are proprietary
integrated optical circuits incorporating silica-based waveguides
on a silicon substrate. The module is less than 10% the volume of
previous optical switches and performs on/off operations at 5V,
like ordinary digital circuits.
As optical processing becomes more important in sensors, data
transmission, telecommunications, and imaging, optical switching
becomes a critical technology for new products. When coupled to
conventional electronics, optical signals must first be converted
into electrical signals before they can be understood by the
instrumentation. Optical switches, which are under development at
dozens of industrial labs worldwide, enable optical signals to be
switched without converting them to electrical signals. The
resulting speed and reliability will greatly increase data
transfer speeds and eliminate the use of photoelectric conversion
components.
NTT plans to develop its optical switching module into a
general-purpose dynamic switching system for computer networks
and high-definition television.
Other companies involved in optical switching:
* Porta Systems, Inc. (Syosset, NY), developer of a bit-rate
and wavelength-independent optical switch for telecommunications
(used by MCI Communications Corp., Washington, DC).
* Astarte Fiber Networks, Inc. (Boulder, CO), which has
developed an all-optical matrix switch for single-mode fiber
optics.
* Optivision, Inc. (Palo Alto, CA), which has received a US
Department of Energy grant for developing a photonic switch for
detectors and instrumentation.
* Bell Northern Research (Toronto, Canada), inventor of
circular grating lasers for use in optical switching, computing,
and other photonic devices.
* PA Consulting (Hightstown, NJ), investigating nonlinear
optical polymers for use in interferometers and optical
switching.
* David Sarnoff Research Center (Princeton, NJ), working with
Sandia National Laboratories (Albuquerque, NM) on two-dimensional
laser diode arrays for high electrical power switches used in
high-impulse radar and communications.
Details: Hiroyki Kanamaru, Nippon Telegraph and Telephone
Corp., 1-6 Uchisaiwai-cho, 1-Chome Chiyoda-ku, Tokyo 100, Japan.
Phone: +81 3 3509 3101. Fax: Fax: +81 3 3509 4290.
Copyright 1993, Technical Insights, Inc., Englewood, NJ 07631
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